Details
- •Sub-floor systems
- •Device cup/device carrier for subfloor system
- •1 KOM
- •OBO
Technical specifications
Number of appliances to build in-
Length-mm
Number of conduit inlets-
Width-mm
Depth-mm
MaterialPolyamide (PA)
Number of strain relieves-
Mounting method installation unitSnap
*VPC is wholesale amount without VAT (tax on added value). For wholesale discounts, please register as business user
7408693 | MT45V TW
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Details
- Sub-floor systems
- Device cup/device carrier for subfloor system
- 1 KOM
- OBO
DetailsTechnical specifications
Technical specifications
Number of appliances to build in
-
Length
-mm
Number of conduit inlets
-
Width
-mm
Depth
-mm
Material
Polyamide (PA)
Number of strain relieves
-
Mounting method installation unit
Snap
VPC is wholesale amount without VAT (tax on added value). For wholesale discounts, please register as business user.