Details
- •Sub-floor systems
- •Device cup/device carrier for underfloor system
- •1 KOM
- •OBO
Technical specifications
MaterialPolyamide (PA)
Installation techniqueGrid size 45
ModelShape of cup
Number of strain relieves2
Length165mm
Number of conduit inlets4
Depth40mm
Number of appliances to build in3
Width76mm
Recommended products
From same serie
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7408723 | UT3 45 3
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Details
- Sub-floor systems
- Device cup/device carrier for underfloor system
- 1 KOM
- OBO
DetailsTechnical specificationsRecommended productsFrom same serie
Technical specifications
Material
Polyamide (PA)
Installation technique
Grid size 45
Model
Shape of cup
Number of strain relieves
2
Length
165mm
Number of conduit inlets
4
Depth
40mm
Number of appliances to build in
3
Width
76mm
From same serie
Recommended products
VPC is wholesale amount without VAT (tax on added value). For wholesale discounts, please register as business user.