Details
- •Sub-floor systems
- •Device cup/device carrier for subfloor system
- •1 KOM
- •HAGER
Technical specifications
ModelShape of cup
Mounting method installation unitSnap
MaterialOther
Number of strain relieves4
Width75mm
Depth53mm
Number of appliances to build in3
Number of conduit inlets4
Length171mm
Related products
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Details
- Sub-floor systems
- Device cup/device carrier for subfloor system
- 1 KOM
- HAGER
DetailsTechnical specificationsRelated products
Technical specifications
Model
Shape of cup
Mounting method installation unit
Snap
Material
Other
Number of strain relieves
4
Width
75mm
Depth
53mm
Number of appliances to build in
3
Number of conduit inlets
4
Length
171mm
Related products
VPC is wholesale amount without VAT (tax on added value). For wholesale discounts, please register as business user.